If form-factor and functionality matters

Intelligent implants are highly complex systems of sensors, actuators and signal processing. In some of the illustrated examples, the need to make the form-factor of the implantable device as low as possible is very obvious. Only by this the increasingly complex and multifunctional system structure can be designed. In particular, concerning sensors and actuators. The manufacturers of these medical implants are recently pursuing 3D integration of heterogeneous components such as sensors, ASICs and other ICs to an assembly.

Using the technology of the Interposers GmbH, "3D-printed interposer technology" - the stacking of heterogeneous components is inexpensive, extremely flexible with respect to design changes, and in comparison to the silicon interposer significant more favorable and also feasible on "Die-Level" ("Die" stands for an already isolated chip).

Note: The figures shown represent an example of use and do not indicate a current actual use of these components.

Together with strategic partners and research institutions we work also on future applications in the fields of automotive, aerospace, consumer electronics, peripherals, electronics, instrumentation engineering, environmental protection, life sciences, etc.

The enabling technology of the "printed 3D interposer" is a comprehensive energy-saving IC technology to connect sensors and interfaces. Thus, components such as MEMS, more specific sensors such as microphones, gyro-sensors, etc., and ASICs or other IC's can be manufactured as "stacked" 3D components within the industrial "back-end manufacturing".

Picture 1:
Picture 1
3D printed interposer technology to connect a sensor-chip on top of a bottom-chip


Picture 2:Picture 2
Deposition of Nano-Silver Ink on silicon wafer sample


Picture 3:Picture 3
6 x magnification of nano-silver ink pads and lines onto a silicon wafer sample